Material information:
Material:
Rice mold/polypropylene
Embossed plate/ABS resin
Embossing pad/silicone
Heat resistance temperature:
Rice mold/120°C
Embossed plate/80°C
Embossed pad/180°C
Precautions:
Do not use in dishwashers and dryers.
Packing list:
Size Information:
Product information: